E-Plater

“E-plater” is a device that was specially developed by Engenharia Caseira (engenhariacaseira.com.br) to make pulsed and reversed pulsed electroplating (PED).

Research shows that molecules on the surface of electrically deposited material using direct current are sometimes disorganized which can result in uneven surface and color.

It is possible to control the composition and thickness of the deposited layer in an atomic order by configuring the amplitude and width of a pulse. The pulses favor the initiation of grain nuclei and increase the number of grains per unit of surface resulting in the thinner deposit with better properties.

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